Koh young KY-8030 - #46168

SPI, Year 2009/11

REQ

Available

Description

3D solder paste inspection system KY-8030-3 GUI version 3.6.2411E120 GER Gerber conversion software SPC Plus software Touchscreen Maximum PCB size 510 × 510 mm Automatic width adjustment SMEMA interface 4 MP high-speed camera