Rehm CondenxoXP Vac - #46016

Reflow Ovens, Year 2013/12

REQ

Available

Description

Vapor phase reflow soldering system with vacuum function Soldering under condensation principle Vacuum chamber for minimization of air inclusions and voids Special cooling manifold for optimized cooling performance Offline system with optional inline operation via additional conveyor PC renewed, pumps replaced Chamber refurbished in 2024 Closed-loop process gas circuit with filter unit Integrated preheating and controlled cooling section Wireless profiling system integrated Spare parts and documentation available Cooling unit to be provided by customer Nitrogen atmosphere Touchscreen control interface with process visualization SMEMA interface Transport direction L->R