Saki BF-3Si - #46324

AOI, Year 2017/03

REQ

Available

Description

Inline operation 3D inspection of solder joints and components Multi-angle camera system with structured light projection Measurement of solder volume, height, and shape Detection of missing components, misalignment, polarity, and solder bridges PCB size Min. approx. 50 x 50 mm Max. approx. 510 x 460 mm Maximum component height: approx. 40 mm SMEMA interface Windows-based operating interface