TRI TR7007 - #44935

SPI, Year 2009

REQ

Available

Description

Solder Paste Inspection (SPI) Camera and Optical Resolution: 4 MP color camera, optical resolution of either 10μm or 14μm. Inspection Speed: Up to 160 cm²/s at 14μm and up to 80 cm²/s at 10μm. Inspection Functions: Detection of defects such as insufficient paste, excessive paste, shape deformation, missing paste, and bridging. Measurements: Height, area, volume, and offset. Mechanical Precision: X,Y resolution of 0.5μm and Z resolution of 1μm. Board Size: 50 x 50mm up to a maximum of 510 x 460mm.