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VI technology PI Primo - #44469

SPI, Year 2017

REQ

Available

LocationCUSTOMER

Description

Solder Paste Inspection system - 3D Vision (Mycronic) 80 Mpixel 3D system High power RBG LED lighting for 3D Color Image Max. paste height measurement: 400 µm Max. PCB size: 533x533 mm Min. PCB size: 50x50 mm