Viscom S 3088 ultra - #45249

AOI, Year 2022/03

REQ

Available

Description

High-speed solder joint inspection with a resolution of up to 8 μm Precise 3D analyses with high-performance sensor technology Unique analysis of QFN, DFN, and QFP dewetting using angled views Inspection speed up to 50 cm²/s Angle views with 4 cameras, 8 cameras optional Z-resolution of 0.5 μm and lateral resolution of 16 μm User-friendly software Viscom vVision/EasyPro Fast PCB handling with Viscom FastFlow, change in up to 2 seconds Integrated verification feature to ensure zero defect escape strategy